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Development of scanning acoustic microscopy method with passive integration package for mass production monitoring

机译：带有被动集成套件的扫描声显微镜方法的开发，用于批量生产监控

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Scanning Acoustic Microscopy (SAM) is a nondestructive method to investigate delamination in packages. However, increasing of integrated function and new material applied into package had posted some challenges in SAM surveillance and analysis. Integration of passive component in moulded packaging has contributed to more complicated analysis for package delamination inspection. Furthermore, introducing of high silver filler die attach material into moulded packaging for passive component bonding have leading confusion on the SAM results interpretation as compare to the usual practice. The new “moon shape” delamination signal observed with white colour contrast normally will be interpreted as a delamination defect under normal SAM image interpretation. However, further cross section analysis and coupled with FIB cut has confirmed that the delamination defect is not genuine. This phenomenon is causing some confusion for operator to differential the real defect sample as compare to the standard production packages. In order to clear the confusion as observed, new sample preparation methodology and scanning apparatus has been introduce for delamination results verification. Pre-sample preparation by partially removing the package backside mould compound had improved the SAM image clarity for easy interpretation. Further experiment with high frequency and short focal length transducers scanning have successfully clear the doubt as observe earlier. The details of the scanning methodology and apparatus applied will be describing details in this paper.
机译：扫描声学显微镜（SAM）是研究包装中分层的一种非破坏性方法。但是，集成功能的增加和将新材料应用于包装中，在SAM监视和分析中提出了一些挑战。将无源组件集成到模压包装中，导致包装脱层检查的分析更加复杂。此外，与常规做法相比，将高银填充剂芯片附着材料引入模制包装中以进行无源组件粘合会导致SAM结果解释混乱。在正常的SAM图像解释下，通常以白色对比度观察到的新的“月形”分层信号将被解释为分层缺陷。但是，进一步的横截面分析以及FIB切割已证实分层缺陷不是真正的缺陷。与标准生产包装相比，这种现象使操作人员难以区分实际缺陷样品。为了消除所观察到的混乱，已经引入了新的样品制备方法和扫描设备以用于分层结果验证。通过部分去除包装背面模塑料的样品前处理，改善了SAM图像的清晰度，易于理解。高频和短焦距换能器扫描的进一步实验已成功清除了先前观察到的疑问。扫描方法和所用设备的详细信息将在本文中进行描述。

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