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Influence of mold compound type towards Palladium doped and copper doped 2N Au wire

机译：模塑料类型对掺钯和掺铜2N金线的影响

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In automotive semiconductor industry, the behaviour of gold (Au) wire is very crucial in sustaining the reliability performance of the product. Due to the motivation to achieve lifetime of high temperature storage (HTS) of 3000hr at 175°C, gold wire with 4N purity (99.99% Au) on AlCu pad cannot be used due to kirkendall voiding after thermal aging. This kirkendall voiding could lead to 1st bond failure during product application. The kirkendall void form when the Al or Au diffuses out of one region faster than the other can diffuse in from the other side of that region [1]. Therefore, 2N wire (99% Au) is recommended to replace 4N wire where the dopants in 2N wire (Pd, Cu, Pt) can limit the intermetallic layer growth and subsequently slows down the formation of kirkendall void. During the 2N wire pre-selection study, two wire types with different dopants, Palladium (Pd) and Copper (Cu) were selected. No failure was observed after HTS for unmolded unit. However, when molded unit were subjected to HTS, lifted bond was detected during ball shear after stress for Cu doped 2N wire. Based on above finding, it is indicated that there is influence of epoxy mold compound (EMC) toward the different dopant properties of 2N wire. Study by researcher [2] also shows that conventional epoxy mold compound do have influence towards the reliability behaviour, due to the presence of halides. In this paper, Pd doped and Cu doped 2N wire will be assessed using green EMC and non-green EMC. Wire Bond (WB) process characteristic (wire pull, ball shear, stress neck, cratering, IMC coverage and IMC growth) at 0hr will be examined. For critical responses such as ball shear and IMC growth, will also be examined after HTS. Investigation on Au-Al intermetallic phase will be performed to understand the diffusion behavior of 2 different dopant wires and a model will be constructed to explain the failure mechanism. This paper will present as a fundamental guideline to select the suitable do- ant base for 2N Au wire type versus epoxy mold compound without compensating the reliability performance.
机译：在汽车半导体行业中，金（Au）线的行为对于维持产品的可靠性性能至关重要。由于有动机在175°C下达到3000小时的高温存储（HTS）寿命，因此在AlCu焊盘上使用4N纯度（99.99％Au）纯度的金线由于热老化后会出现空缺而无法使用。该kirkendall空隙可能会导致在产品应用过程中发生第一次粘结失败。当Al或Au扩散出一个区域的速度快于另一个区域扩散时，基尔肯德尔空隙形式可以从该区域的另一侧扩散出来[1]。因此，如果2N导线（Pd，Cu，Pt）中的掺杂剂会限制金属间层的生长并减慢基尔肯德尔空洞的形成，则建议使用2N导线（99％Au）代替4N导线。在2N导线预选研究中，选择了两种掺杂类型不同的导线，即钯（Pd）和铜（Cu）。未模制的单元在HTS之后未观察到故障。但是，当对模制单元进行高温超导处理时，掺杂铜的2N导线在应力作用后的球形剪切过程中会检测到粘结力升高。基于以上发现，表明环氧模塑化合物（EMC）对2N线材的不同掺杂性能有影响。研究人员[2]的研究还表明，由于存在卤化物，传统的环氧模塑料确实会对可靠性行为产生影响。在本文中，将使用绿色EMC和非绿色EMC评估Pd掺杂和Cu掺杂的2N导线。将检查0小时时的焊线（WB）工艺特性（焊丝拉力，球形剪切，应力颈，缩孔，IMC覆盖率和IMC生长）。对于关键响应，例如球切变和IMC增长，还将在HTS之后进行检查。将进行Au-Al金属间相的研究，以了解2种不同的掺杂剂线的扩散行为，并建立一个模型来解释失效机理。本文将作为选择2N金线类型而不是环氧模塑料的合适添加剂基础的基本指南，而不会对可靠性性能造成影响。

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