The study of adhesive performance within backside-via revealing

机译：背面通孔内粘合性能的研究

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BSR (back-side via revealing) of TSV wafers after temporary bonding is very critical process within 3D integration. Adhesive performances of the temporary bonding were inspected step by step within BSR process by IR inspection system. We found out the delamination happened after backside dielectric deposition at specific pattern. The delamination area and structure were inspected and reported in this paper.

机译：临时粘合后，TSV晶圆的BSR（背面通孔显示）是3D集成中非常关键的过程。通过IR检查系统，在BSR过程中逐步检查了临时粘合的粘合性能。我们发现在特定图案的背面电介质沉积之后发生了分层。本文对分层区域和结构进行了检查并进行了报告。

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《IEEE Electronics Packaging Technology Conference》|2014年|84-87|共4页
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Li H.Y.; Ding Lixin; Lo G.Q.;
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adhesive bonding; delamination; inspection; three-dimensional integrated circuits; 3D integration; IR inspection system; TSV wafers; adhesive performance; backside dielectric deposition; backside-via revealing; delamination; temporary bonding; Bonding; Curing; Dielectrics; Inspection; Polymers; Silicon; Through-silicon vias;

机译：粘接;分层;检查;三维集成电路; 3D集成; IR检查系统; TSV晶片;粘接性能;背面电介质沉积;背面通孔显示;分层;临时粘接;粘接;固化;电介质;检查;聚合物;硅;直通硅通孔;

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The study of adhesive performance within backside-via revealing

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