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FAST AND LOW COST LOCALIZED METAL PROCESSING FOR SILICON SOLAR CELL

机译：硅太阳能电池的快速低成本本地化金属加工

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In this work, we demonstrate how a novel localized metallization process is able to completely eliminate silver from the back side of silicon solar cell. Different metals, such as nickel and copper, have been deposited by an innovative technique based on dynamic liquid drop/meniscus able to touch the aluminum rear surface in specific defined positions. High resolution scanning electron microscopy and compositional microanalysis with energy dispersive X-ray microanalysis have been employed to evaluate the dispersion of metals within the aluminum-silicon inter-diffused region. We have performed electrical characterization of solar cells manufactured with novel nickel- and copper-based rear metallization. We have manufactured nickel- and copper-based solder pads showing the adhesion as high as 4 N/mm, higher than required according to the DIN EN 50461 specimen. Efficiency increase of up to 0.48 % has been achieved respect equivalent silver-based rear metallization.
机译：在这项工作中，我们演示了一种新颖的局部金属化工艺如何能够从硅太阳能电池的背面完全消除银。通过基于动态液滴/弯液面的创新技术可以沉积不同的金属（例如镍和铜），该液滴能够在特定的定义位置接触铝背面。高分辨率扫描电子显微镜和具有能量色散X射线显微分析的成分显微分析已用于评估铝-硅相互扩散区​​域内金属的分散性。我们已经对采用新型镍基和铜基背面金属化工艺制造的太阳能电池进行了电学表征。我们已经制造出镍基和铜基焊盘，其附着力高达4 N / mm，高于根据DIN EN 50461样品的要求。相对于同等的银基背面金属镀层，效率提高了0.48％。

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