首页> 外文会议>IEEE Photovoltaic Specialists Conference >Progress toward developing a novel module architecture for increased reliability and reduced costs
【24h】

Progress toward developing a novel module architecture for increased reliability and reduced costs

机译:在开发新颖的模块架构以提高可靠性和降低成本方面取得了进展

获取原文

摘要

Module reliability has a direct impact on the levalized cost of energy, and reliability issues for thin film PV have been consistently reported. Direct Solar LLC is developing a new module architecture for thin film PV that has robustness to moisture and excellent adhesion under UV light exposure. Process cycle times for each manufacturing step is under 1 minute using low capital cost, small footprint tooling. The patent pending architecture utilizes a specialized two part edge seal. The modules are fabricated without lamination, vacuum pressing or module heating. An initial version of this design has passed IEC 61646 and UL 1703 certification tests and 4500+ hrs. of the rigorous 85 C / 85% relative humidity “damp heat test”.
机译:模块的可靠性直接影响到能源的平均成本,并且薄膜PV的可靠性问题一直得到报道。 Direct Solar LLC正在开发一种用于薄膜PV的新模块架构,该架构具有防潮性能,并且在紫外线照射下具有出色的附着力。使用较低的投资成本和较小的占地面积的工具,每个制造步骤的处理周期时间都在1分钟以内。正在申请专利的体系结构采用了专门的两部分边缘密封。模块的制造无需层压,真空压制或模块加热。该设计的初始版本已通过IEC 61646和UL 1703认证测试,并经过4500多个小时的测试。严格的85 C / 85%相对湿度的“湿热测试”。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号