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首页> 外文会议>International Conference on Computer, Communications, and Control Technology >High speed PCB spiral with patch EBG planar integration for EMI reduction
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High speed PCB spiral with patch EBG planar integration for EMI reduction

机译：高速PCB和螺旋线与贴片EBG平面集成，可降低EMI

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摘要

The need of high-speed printed circuit board design has increased in modern integrated circuitry while maintaining signal integrity and EMC standards as they became challenging issue. In this work, a high-speed PCB design which emitted high radiated emissions exceeding the EMC standard limits up to 4.54 GHz, has been fabricated and gone under radiated emission test. The EMI of the proposed PCB at 4.54 GHz has been suppressed using EBG spiral with patch planar that was integrated into the noisy PCB. Analyses of these characteristics indicate that the proposed EBG structures design is appropriate for the target EMI reduction.
机译：在现代集成电路中，对高速印刷电路板设计的需求在增加，同时又保持了信号完整性和EMC标准，因为它们已成为具有挑战性的问题。在这项工作中，已经制造出一种高速PCB设计，该设计发出的辐射超过EMC标准限制（高达4.54 GHz），并且已经经过辐射发射测试。提议的PCB在4.54 GHz时的EMI已使用带有集成到噪声PCB中的贴片平面的EBG螺旋线得到抑制。对这些特性的分析表明，提出的EBG结构设计适合降低目标EMI。

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