• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>IEEE International Conference on Electronic Measurement Instruments >A method for extracting TSV feature points based on optical micro-image
【24h】

A method for extracting TSV feature points based on optical micro-image

机译：一种基于光学显微图像的TSV特征点提取方法

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

As the latest interconnect technology, Silicon (TSV, Through-Silicon-Via) is passed through chip and chip, wafer and wafer for vertical conduction, it greatly reduce the cable length and electrical signals delays, also improve the integration of electronic devices and electrical performance, as the latest 3D circuit integration technology, the TSV occupy a large area of the circuit compare to the entire size of the circuit board, so the TSV layout has become an important factor in the affecting the performance of the chip, How to propose an effective way to provide a basis for judging the layout of TSV has become a focus in the TSV current study. Based on considering the TSV small size and the high reflectance characteristics, we build the optical micro imaging system, based on optical microscopic images, this article present a method for extraction the TSV feature points, The method process the TSV micro-image with threshold segmentation; expansion corrosion and other preprocessing, then label the coordinates of connected components. By using the centroid method we extract the feature points coordinate, and the experiments results show that this method can be very good to meet the requirements of our experiments and extract the TSV feature points coordinates successfully, this work also make foundation for the TSV-based layout.
机译：作为最新的互连技术，硅（TSV，Through-Silicon-Via）通过芯片和芯片，晶圆和晶圆进行垂直传导，极大地减少了电缆长度和电信号延迟，还改善了电子设备和电气的集成度性能方面，作为最新的3D电路集成技术，TSV与电路板的整体尺寸相比占据了较大的电路面积，因此TSV布局已成为影响芯片性能的重要因素，如何提出为TSV布局的判断提供有效依据的有效方法已成为TSV当前研究的重点。在考虑TSV尺寸小和高反射率特性的基础上，构建了基于光学显微图像的光学显微成像系统，提出了一种提取TSV特征点的方法，该方法采用阈值分割的方法处理TSV显微图像。 ;膨胀腐蚀和其他预处理，然后标记连接的组件的坐标。通过质心法提取特征点坐标，实验结果表明，该方法能够很好地满足实验要求，能够成功提取TSV特征点坐标，为基于TSV的算法奠定了基础。布局。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号