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首页> 外文会议>European seminar on precision optics manufacturing >Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools
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Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools

机译：使用新型树脂结合金刚石工具对硅酸盐材料进行超细研磨

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摘要

The fabrication of high-quality optical components involves great effort. Polishing often functions as the final step in a manufacturing chain. To reduce the conventionally time-consuming, complex polishing process with loose grain, an interesting approach with novel resin bond grinding tools is presented for surface smoothing. Various processing-experiments were carried out, regarding different silicate materials such as BK7® and fused silica. Among other results it is shown, that good surface qualities with low roughness down to R_a = 8 nm or R_q = 10 nm can be achieved so far, a quality that already allows speaking of "ultra-fine" grinding. This results in remarkable possibilities to reduce conventional fine-machining procedures with loose abrasives. The fine grinded components can directly be polished to finally smooth the surface and remove remaining defects. Total-processing-times can be strongly reduced, involving significant economic advantages.
机译：高质量光学组件的制造需要付出巨大的努力。抛光通常是制造链中的最后一步。为了减少传统的耗时，松散晶粒的复杂抛光过程，提出了一种使用新型树脂粘结研磨工具进行表面平滑的有趣方法。针对不同的硅酸盐材料，例如BK7®和熔融石英，进行了各种加工实验。在其他结果中显示，到目前为止，可以实现低粗糙度直至R_a = 8 nm或R_q = 10 nm的良好表面质量，这种质量已经可以说是“超细”磨削了。这导致减少使用松散磨料的常规精细加工程序的显着可能性。细磨过的零件可以直接抛光以最终使表面光滑并去除残留的缺陷。可以大大减少总处理时间，从而带来显着的经济优势。

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