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Optimizing DSA-MP decomposition and redundant via insertion with dummy vias

机译：优化DSA-MP分解和冗余通孔插入

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Block copolymer directed self-assembly (DSA) has emerged as an economical complementary technology in the midst of next generation lithography. In particular, DSA has a strong potential for contact hole and via patterning. However, high via density in sub-10nm technology node makes it very hard to manufacture all the vias using DSA only. Complementing DSA with multiple patterning (MP) is an option such that multiple masks are used to print the DSA guiding templates for guiding the self-assembly of the block copolymer. Besides, redundant via insertion is desirable because it is an effective means to reduce yield loss due to via defect and improve reliability. To the best of our knowledge, we are the first work to consider DSA-MP decomposition and redundant via insertion with dummy via consideration to enhance manufacturability. Experimental results shows the effectiveness and efficiency of our method compared with previous works and resulted in 0 un-manufacturable vias for all benchmarks.
机译：在下一代光刻技术中，嵌段共聚物定向自组装（DSA）已成为一种经济的补充技术。尤其是，DSA在接触孔和通孔图案方面具有强大的潜力。但是，低于10nm的技术节点中的过孔密度很高，因此仅使用DSA很难制造所有过孔。 DSA与多种图案（MP）的互补是一种选择，以便使用多个遮罩来印刷DSA引导模板，以指导嵌段共聚物的自组装。此外，期望多余的通孔插入，因为这是减少由于通孔缺陷引起的良率损失并提高可靠性的有效手段。据我们所知，我们是第一个考虑DSA-MP分解和冗余插入（通过假人插入）以提高可制造性的工作。实验结果表明，与以前的工作相比，该方法的有效性和效率高，并且所有基准均导致0个无法制造的通孔。

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