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首页> 外文会议>International Conference on Solid-State Sensors, Actuators and Microsystems >A bonding method between poly(lactic acid) (PLA) and poly(methyl methacrylate) (PMMA) for microfluidic chips
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A bonding method between poly(lactic acid) (PLA) and poly(methyl methacrylate) (PMMA) for microfluidic chips

机译：聚乳酸（PLA）和聚甲基丙烯酸甲酯（PMMA）之间的微流控芯片键合方法

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摘要

This article presents a novel method to bond poly(lactic acid) (PLA), a 3D-printing material, and poly(methylmethacrylate) (PMMA), a popular substrate material for microfluidic applications. With this technique, the tubing connectors can be fabricated by 3D printing and make this PMMA/PLA hybrid microfluidic chip extremely easy to use for experiments. The mechanism behind this method is based on the polymer dissolution, molecular diffusion, and re-crosslinking of polymer chains. The major challenge of bonding this hybrid chip is the high level surface roughness of PLA substrates with its significant influences on bonding strength [1]. After Ethanol treatment and UV irradiation of this hybrid chip, a post-annealing step was realized to facilitate the bonding. To further analyze the bonding quality, several inspections including leakage test, cross-sectional image by microscope, and pressure bursting test were conducted. The experiment results clearly showed that this method could successfully and rapidly form a strong bond (over 13 bars) between PLA and PMMA substrates.
机译：本文提出了一种新颖的方法来粘合3D打印材料聚乳酸（PLA）和流行的微流体应用基质材料聚甲基丙烯酸甲酯（PMMA）。通过这种技术，可以通过3D打印来制造管道连接器，并使这种PMMA / PLA混合微流体芯片非常易于用于实验。该方法背后的机理是基于聚合物的溶解，分子扩散和聚合物链的再交联。粘接这种混合芯片的主要挑战是PLA基板的高表面粗糙度及其对粘接强度的显着影响[1]。在对该混合芯片进行乙醇处理和紫外线照射后，实现了后退火步骤以促进键合。为了进一步分析键合质量，进行了几项检查，包括泄漏测试，显微镜横截面图像和压力破裂测试。实验结果清楚地表明，该方法可以成功，快速地在PLA和PMMA基材之间形成牢固的键合（超过13 bar）。

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