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Comparative study on the transmission gain between on-chip cylindrical dielectric resonators antenna and on-chip circular microstrip patch antenna for 60-GHz communications

机译:用于60 GHz通信的片上圆柱形介质谐振器天线和片上圆形微带贴片天线之间的传输增益的比较研究

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This paper demonstrates the comparison between two on-chip antennas, circular microstrip patch antenna (CMPA), and cylindrical dielectric resonator antenna (CDRA), planned for operation at 60 GHz and integrated into 0.18-μm CMOS integrated circuits. The antennas are fed with similar feeding networks. The bandwidth for a return loss below -10 dB is 17.9 % for CMPA and 21 % for CDRA. The simulated radiation patterns of both antennas exhibit similar properties. The gain of the CDRA is 2.2 dB higher than CMPA. Likewise, the results show that the radiation efficiency of CDRA is significantly higher than that of the CMPA at 60 GHz. A comparative study on the transmission gain for wireless interconnections using CMPA and CDRA in the cases of intra- and inter-chip interconnections is investigated. Transmission gain proves the superiority of CDRA compared to CMPA. The proton implantation technique is used to improve the transmission gain. The silicon substrate resistivity is increased from 10 Ω-cm up to 10 MΩ-cm.
机译:本文演示了计划在60 GHz下运行并集成到0.18μmCMOS集成电路中的两个片上天线,圆形微带贴片天线(CMPA)和圆柱介电谐振器天线(CDRA)之间的比较。天线通过类似的馈电网络馈电。低于-10 dB的回波损耗的带宽对于CMPA为17.9%,对于CDRA为21%。两个天线的模拟辐射图显示出相似的特性。 CDRA的增益比CMPA高2.2 dB。同样,结果表明,在60 GHz频率下,CDRA的辐射效率明显高于CMPA。在芯片内和芯片间互连的情况下,对使用CMPA和CDRA进行无线互连的传输增益进行了比较研究。与CMPA相比,传输增益证明了CDRA的优越性。质子注入技术用于提高传输增益。硅基板的电阻率从10Ω-cm增加到10MΩ-cm。

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