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首页> 外文会议>ASME international conference on nanochannels, microchannels and minichannels >THERMAL PERFORMANCE OF MICRO-JET IMPINGEMENT DEVICE WITH PARALLEL FLOW, JET-ADJACENT FLUID REMOVAL
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THERMAL PERFORMANCE OF MICRO-JET IMPINGEMENT DEVICE WITH PARALLEL FLOW, JET-ADJACENT FLUID REMOVAL

机译：平行流动，邻近射流的微射流冲击装置的热性能

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In a variety of electronic systems, cooling of various components imposes a significant challenge. A major aspect that inhibits the performance of many cooling solutions is the thermal resistance between the chip package and the cooling structure. Due to its low thermal conductivity, the thermal interface material (TIM) layer imposes a significant thermal resistance on the chip to cooling fluid thermal path. Advanced cooling methods that bypass the TIM have shown great potential in research and some specialty applications, yet have not been adopted widely by industry due to challenges associated with practical implementation and economic constraints. One advanced cooling method that can bypass the TIM is jet impingement. The impingement cooling device investigated in the current study is external to the integrated circuit (IC) package and could be easily retrofitted onto any existing microchip, similar to a standard heatsink. Jet impingement cooling has proven effective in previous studies. However, it has been shown that jet-to-jet interference severely degrades thermal performance of an impinging jet array. The present research addresses this challenge by utilizing a flow path geometry that allows for withdrawal of the impinging fluid immediately adjacent to each jet in the array. In this study, a jet impingement cooling solution for high-performance ICs was developed and tested. The cooling device was fabricated using modern advanced manufacturing techniques and consisted of an array of micro-scale impinging jets. A second array of fluid return paths was overlain across the jet array to allow for direct fluid extraction in the immediate vicinity of each jet, and fluid return passages were oriented in parallel to the impinging jets. The following key geometric parameters were utilized in the device: jet diameter (D = 300μm), distance from jet to impinging surface (H/D = 2.5), spacing between jets (S/D = 8), spacing between fluid returns (S_r/D = 8), diameter of fluid returns (D_r/D = 5). The device was mounted to a 2cm × 2cm uniformly heated surface which produced up to 165W and the resulting fluid-to-surface temperature difference was measured at a variety of flow rates. For this study, the device was tested using single-phase water. Jet Reynolds number ranged from 300 - 1500 and an average heat transfer coefficient of 13,100 W m~(-2) K~(-1) was achieved at a Reynolds number of only Re_d = 305.
机译：在各种电子系统中，各种部件的冷却带来了巨大的挑战。阻碍许多冷却解决方案性能的一个主要方面是芯片封装和冷却结构之间的热阻。由于其低导热率，热界面材料（TIM）层在芯片上对冷却流体的热路径施加了很大的热阻。绕过TIM的先进冷却方法已在研究和某些特殊应用中显示出巨大潜力，但由于与实际实施和经济限制相关的挑战，尚未被工业广泛采用。可以绕过TIM的一种先进的冷却方法是射流冲击。本研究中研究的冲击冷却装置位于集成电路（IC）封装的外部，可以很容易地改装到任何现有的微芯片上，类似于标准散热器。在以前的研究中，射流冲击冷却已被证明是有效的。但是，已经表明，射流之间的干扰严重降低了撞击射流阵列的热性能。本研究通过利用流路几何形状解决了这一挑战，该流路几何形状允许将与阵列中的每个喷嘴紧邻的撞击流体抽出。在这项研究中，开发并测试了用于高性能IC的射流冲击冷却解决方案。冷却装置是使用现代先进的制造技术制造的，由一系列微型撞击喷嘴组成。流体喷射路径的第二阵列覆盖整个喷射器阵列，以允许在每个喷射器的紧邻处直接提取流体，并且流体返回通道的方向平行于撞击的喷射器。该设备使用了以下关键几何参数：射流直径（D =300μm），从射流到撞击表面的距离（H / D = 2.5），射流之间的间距（S / D = 8），回油之间的间距（S_r / D = 8），回油口直径（D_r / D = 5）。将该装置安装在2cm×2cm均匀加热的表面上，该表面产生的功率高达165W，并在各种流速下测量了产生的液面温度差。对于本研究，使用单相水对该设备进行了测试。射流雷诺数在300-1500之间，在仅Re_d = 305的雷诺数下，平均传热系数为13,100 W m〜（-2）K〜（-1）。

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