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首页> 外文会议>International Conference on Ion Implantation Technology >Development of Electrically Conductive DLC Coated Aluminum Substrate for the Advanced Electric Storage Devices by Plasma Ion Assisted Deposition Method
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Development of Electrically Conductive DLC Coated Aluminum Substrate for the Advanced Electric Storage Devices by Plasma Ion Assisted Deposition Method

机译：等离子辅助沉积法开发用于高级电存储设备的DLC涂层导电铝基板

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This paper relates to the development of electrically conductive DLC coated Aluminum (Al) substrate for the advanced electric storage devices by Plasma Ion Assisted Deposition (PIAD) method. Due to its low contact resistance and high corrosion resistance capability the electrically conductive DLC coated Al substrate is confirmed to be useful as the electrode material of the electric storage devices such as EDLC, LiC, LiB, especially for the increase of the cell voltage.
机译：本文涉及通过等离子辅助沉积（PIAD）方法开发用于高级电存储设备的导电DLC涂层铝（Al）基板。由于其低的接触电阻和高的耐腐蚀性，证实了涂覆有导电DLC的Al基板可用作诸如EDLC，LiC，LiB的蓄电装置的电极材料，特别是用于提高电池电压。

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