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Validation of a Finite Element Thermal Analysis Model of a Simple Electronics Board

机译：验证简单电子板的有限元热分析模型

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Increasing demand for electronics leads excess heat dissipation inside narrow enclosures. This problem requires accurate thermal analysis of an electronics unit in order the system works properly throughout the mission. The first step for performing an accurate analysis is to set up the correct analysis model. The input parameters for the analysis such as heat dissipation from components, thermal contact resistance between the components and the board etc. usually have some uncertainties in practical applications. Those uncertainties must be eliminated in order to have a correct analysis model. In this paper, verification of the thermal analysis model of a simple electronics board with two heat dissipating components in natural convection environment is performed. Within the scope of the study, a thermal test is carried out whose results are used for tuning the input parameters which have uncertainties. After the correction process, that is, after tuning the uncertain parameters, the analysis model is verified with another test at different configuration in order to verify that the correct analysis model is set up. For the thermal analyses, a commercial finite element software is used. Results of the second analysis and the test which are performed at the verification step match within an acceptable error range. By this inference it can be said that the analysis model with the foregoing corrected parameters can be used for further different configurations and different power dissipation conditions for estimating the thermal performance of the electronics unit.
机译：对电子产品的需求不断增长，导致狭窄的机箱内产生过多的热量。这个问题需要对电子单元进行精确的热分析，以使系统在整个任务期间都能正常工作。进行准确分析的第一步是建立正确的分析模型。用于分析的输入参数，例如组件的散热，组件与电路板之间的热接触电阻等，在实际应用中通常会有一些不确定性。必须消除那些不确定性，以建立正确的分析模型。在本文中，对自然对流环境中具有两个散热组件的简单电子板的热分析模型进行了验证。在研究范围内，进行了热测试，其结果用于调整具有不确定性的输入参数。在校正过程之后，即在调整了不确定参数之后，使用另一种在不同配置下的测试来验证分析模型，以验证是否建立了正确的分析模型。对于热分析，使用商业有限元软件。在验证步骤执行的第二次分析和测试的结果在可接受的误差范围内匹配。通过这种推断，可以说具有上述校正参数的分析模型可以用于进一步不同的配置和不同的功耗条件，以估计电子单元的热性能。

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