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首页> 外文会议>International Conference on Electronic Packaging Technology >Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment
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Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment

机译：铜纳米粒子的尺寸分布对芯片贴装用铜浆无压粘结性能的影响

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Cu nanoparticles (NPs) with two different size distributions were synthesized by a chemical reduction method, which are polydispersed Cu NPs with size in the range of 10 nm to 100 nm and bimodal-sized Cu NPs with large irregular-shaped particles (125 nm) surrounded by small NPs (9 nm). Cu pastes prepared by mixing the Cu NPs with the solvent were used to bond dummy die (i.e., copper plate with silver coating) and bare copper substrate. The results demonstrate that the bimodal-sized Cu NP based paste performs better than the other one in mechanical property of joints. Besides, the shear strength of joints fabricated by such paste can reach 52.6 MPa after pressureless sintering at 280 °C for 10 min in the atmosphere of nitrogen. The copper paste capable of pressureless sintering and making joints with high strength is a promising material for die attachment of IGBT.
机译：通过化学还原法合成了两种不同尺寸分布的铜纳米颗粒，分别是大小在10 nm至100 nm范围内的多分散Cu NP和具有较大不规则形状颗粒（125 nm）的双峰型Cu NP。被小NP（9 nm）包围。通过将Cu NP与溶剂混合而制备的Cu糊剂用于粘合虚拟管芯（即具有银涂层的铜板）和裸铜基板。结果表明，双峰尺寸的基于铜纳米颗粒的糊剂在接头的机械性能方面比另一种更好。此外，在氮气氛下，于280°C进行10分钟的无压烧结后，由这种糊状物制成的接缝的剪切强度可以达到52.6 MPa。能够进行无压烧结并形成高强度接头的铜浆是用于IGBT裸片连接的一种有前途的材料。

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