Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

机译：纳米铜粉与纳米铜粉混合比例对烧结性能的影响研究

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Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field as its superiorities on lower cost, higher melting temperature without electromigration. In this study, Taguchi method is applied to study and analyze the effect of nano-/micro- particle ratio on sintering properties. Sintering temperature is also taken into account since it depends on the particle size a lot. The results show that both sintering temperature and nano-micro- ratio play significant role on influencing shear strength. The best combination is 300 nm with 1 um mixing (1:1) with over 35 MPa shear strength with 300°C sintering temperature. The fracture surface result shows that the crack propagated in the sintering body. Furthermore, the cross-section inspection reveals dense bonding and clearly sintering necking, and the porosity is lower than 12%. 227.8 W/m*K thermal conductivity and 6.0 uΩ•cm electrical resistivity are measured for the sample, which indicates the great potential for the packaging application in high power situation.

机译：纳米金属烧结由于其对提高可靠性的积极作用，是下一代半导体封装的有前途的技术。与银烧结相比，铜基烧结技术具有低成本，较高的熔化温度且无电迁移的优势，因此在模片附着领域具有更大的应用潜力。在这项研究中，Taguchi方法用于研究和分析纳米/微粒比率对烧结性能的影响。还考虑到烧结温度，因为它很大程度上取决于粒度。结果表明，烧结温度和纳米比都对剪切强度有重要影响。最佳组合是300 nm和1 um混合（1：1），在300°C的烧结温度下具有超过35 MPa的剪切强度。断裂表面结果表明裂纹在烧结体中扩展。此外，横截面检查显示出紧密的结合和明显的烧结颈缩，并且孔隙率低于12％。样品测得的热导率为227.8 W / m * K，电阻率为6.0uΩ•cm，这表明在大功率情况下包装应用具有很大的潜力。

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《International Conference on Electronic Packaging Technology》|2020年|1-5|共5页
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Xu Liu; Quan Zhou; Qipeng Liu; Honghao Tang; Chenshan Gao; Bin Xie; Sau Wee Koh; Huaiyu Ye; Guoqi Zhang;
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Copper; Temperature; Electronic packaging thermal management; Thermal conductivity; Conductivity; Temperature measurement; Surface cracks;

机译：铜;温度;电子封装热管理;热导率;电导率;温度测量;表面裂纹;

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Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

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