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首页> 外文会议>IEEE Electronic Components and Technology Conference >Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile Electronics
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Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile Electronics

机译：平面辐射结构热电冷却器，用于移动电子中的局部热点冷却

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In recent years, clock speed and power density have increased rapidly, improving the performance of mobile devices, and thus, thermal management issues for local hot spots of chips are increasing. Dynamic thermal management (DTM) through frequency modulation and passive cooling components such as heat pipes is currently being used as a cooling strategy for mobile devices. However, DTM has an inverse relationship with chip performance, and passive cooler occupy too much space for local hot spot cooling. From the point of view of local hot spot cooling, a solid-state thermoelectric cooler (TEC) has the advantage of enabling on/off control and site-specific cooling. However, most of the research on TECs focuses on the material or interfacial properties of TECs, not the design rule or structure of TECs for practical applications. This study proposes an active cooling device using a TEC with a unique planar-radial structure that can selectively cool only locally generated hot spots and minimize form factor designs with 2D structures, making this cooling device highly applicable to mobile devices. A 5-pair TEC using the optimized TE leg thickness (n-Bi2Te3 5.05 μm and p-Sb2Te3 5.45 μm) and radial structure enhanced the Peltier effect and confirmed the maximum junction temperature difference of 2.4 °C. By adopting a hybrid cooling system combining active and passive coolers in a mobile device, we obtained an effective cooling area ratio of 4 and a cooling effect (~3.87 °C).
机译：近年来，时钟速度和功率密度迅速提高，从而改善了移动设备的性能，因此，芯片局部热点的热管理问题也越来越多。通过频率调制和被动冷却组件（例如热管）的动态热管理（DTM）当前正用作移动设备的冷却策略。但是，DTM与芯片性能成反比关系，并且被动式冷却器会占用过多的空间来进行局部热点冷却。从局部热点冷却的角度来看，固态热电冷却器（TEC）具有实现开/关控制和针对特定地点的冷却的优势。但是，大多数关于TEC的研究都集中在TEC的材料或界面特性上，而不是针对实际应用的TEC的设计规则或结构。这项研究提出了一种主动冷却设备，该设备使用具有独特平面辐射状结构的TEC，可以选择性地仅冷却局部产生的热点，并通过2D结构将外形设计最小化，从而使该冷却设备高度适用于移动设备。使用优化的TE引脚厚度（n-Bi2Te3 5.05μm和p-Sb2Te3 5.45μm）和径向结构的5对TEC增强了珀尔帖效应，并确认了最大结温差为2.4°C。通过在移动设备中采用混合了主动冷却器和被动冷却器的混合冷却系统，我们获得了有效的冷却面积比为4和冷却效果（〜3.87°C）。

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