This paper describes a realtime 3D sound localization algorithm to be implemented with the use of a low-power embedded DSP. A distinctive feature of this implementation approach is that the audible frequency band is divided into three, in accordance with the analysis of the sound reflection and diffraction effects through different media from a certain sound source to human ears. In the low, intermediate, and high frequency subbands, different schemes of the 3D sound localization are devised by means of an IIR filter, parametric equalizers, and a comb filter, respectively, so as to be run in realtime on a 16 bit fixed-point DSP at a low frequency of 50 MHz, maintaining the high-quality sound localization. As a result of a DSP implementation and a subject listening test, this 3D sound localization scheme can be applied to mobile applications such as headphones and a handy-phone with the use of an embedded DSP.
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