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Through-thickness Microstructure, Texture and Strength Gradients in AA 7055 Rolled Plate

机译:AA 7055轧制钢板的贯穿厚度组织,织构和强度梯度

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Through-thickness microstructure, texture and mechanical property gradients in the longitudinal section of AA 7055 rolled plate have been investigated using electron back-scattered diffraction (EBSD) technique. Quantitative analysis of the microstructure and texture through the plate thickness was conducted. It was found that the microstructure and texture are obviously non-homogeneous through the plate thickness. From center to surface, more equiaxed grains are observed. As expected, the degree of recrystallization increases with increasing the S value. The grains in the center layer exhibited preferential orientations while the most grains near the surface presented a random one. The strength of each observed layer has also been tested.
机译:使用电子背散射衍射(EBSD)技术研究了AA 7055轧制板纵截面的厚度,组织和力学性能梯度。通过板厚对组织和组织进行定量分析。已经发现,在整个板厚上,微观结构和织构显然是不均匀的。从中心到表面,观察到更多等轴晶粒。正如预期的那样,重结晶度随S值的增加而增加。中心层中的晶粒表现出优先的取向,而靠近表面的大多数晶粒呈现出随机的取向。每个观察到的层的强度也已经过测试。

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