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首页> 外文会议>Electron Devices Meeting (IEDM), 2009 >Silicon photonics technologies for monolithic electronic-photonic integrated circuit (EPIC) applications: Current progress and future outlook
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Silicon photonics technologies for monolithic electronic-photonic integrated circuit (EPIC) applications: Current progress and future outlook

机译：用于单片电子光子集成电路（EPIC）应用的硅光子技术：当前进展和未来展望

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Research into the limits of electrical interconnects indicates that metal wire is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor. Severe information latency and power consumption are key technological challenges facing the traditional copper interconnects which impose tremendous constraints to keep up with the performance roadmap known as Moore's Law. The shift of paradigm in computer architecture that enables significant parallelism based on a radically new communication landscape will be a remarkable breakthrough. Converging electronic and photonic integrated circuits (EPIC) on a single chip platform to enable functional diversification emerges as one promising approach which could be realized by taking the advantage of low energy and huge data capacity of optical interconnects. By leveraging on the wealth of CMOS technology know-how and infrastructures, the fundamental photonics building blocks that are essential for the demonstration of low-cost EPIC platform have been successfully developed in this work. We present an overview on the current status of this critical technology development and provide an outlook for the monolithic integration of Si micro- and nano-photonics. A seamless integration of EPIC is poised to become a promising technology to meet the bandwidth and energy requirements of data communication in future technology nodes.
机译：对电气互连极限的研究表明，金属线不太可能成为支持下一代微处理器不断增长的功能的最终解决方案。严重的信息等待时间和功耗是传统铜互连面临的关键技术挑战，这些铜互连施加了巨大的限制，以跟上被称为摩尔定律的性能路线图。计算机架构范式的转变将带来巨大的突破，这种转变将基于一个全新的通信环境而实现显着的并行性。将电子和光子集成电路（EPIC）集成在单个芯片平台上以实现功能多样化已成为一种有前途的方法，可以通过利用低能量和光互连的巨大数据容量的优势来实现这一目标。通过利用丰富的CMOS技术知识和基础设施，已成功开发了对低成本EPIC平台演示至关重要的基本光子学构建基块。我们对这一关键技术的发展现状进行了概述，并为硅微光子和纳米光子的单片集成提供了前景。 EPIC的无缝集成有望成为一项有前途的技术，以满足未来技术节点中数据通信的带宽和能源需求。

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