• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>2010 11th International Conference on Electronic Packaging Technology High Density Packaging >Study on the surface modification of silica particle and its filled epoxy resin
【24h】

Study on the surface modification of silica particle and its filled epoxy resin

机译：二氧化硅颗粒及其填充环氧树脂的表面改性研究

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Silica particle-filled epoxy resin is widely used in electronic packaging. In this research, the isocyanate-terminated polydimethylsiloxane (ITPDMS) was synthesized by terminal-hydroxyl polydimethylsiloxane (HTPDMS) and 2, 4-toluene diisocyanate (TDI) firstly. Then the ITPDMS was used for the surface graft modification of micro-level silica. The ITPDMS modified silica (P-SiO2) was filled into epoxy resin for enhancing the interfacial bonding between silica and ER matrix. For comparison, the modification of silica particle with other compounds such as silane coupling agent (KH-560) and 2, 4-toluene diisocyanate and their performances of particle-filled epoxy resins were also investigated. The various modified and unmodified SiO2 were characterized by FTIR and TG. The mechanical properties of silica filled ER were measured by universal testing machine and Dynamic mechanical analysis (DMA). The morphology of silica particle filled epoxy resin was also evaluated by scanning electron microscopy (SEM) investigation of fracture surface. The results show that SiO2 can be grafted with ITPDMS, TDI, and KH-560 effectively and the tensile strength and bending strength of the series modified SiO2 filled ER systems are improved obviously. Especially, the tensile strength and bending strength of P-SiO2 filled ER systems increase by 11.68% and 11.55% than those of the original SiO2 filled ER respectively. The glass transition temperature of P-SiO2-filled ER system was also increased, compared with those of the original SiO2-filled ER.
机译：填充有二氧化硅颗粒的环氧树脂广泛用于电子包装中。本研究以端羟基聚二甲基硅氧烷（HTPDMS）和2，4-甲苯二异氰酸酯（TDI）为原料合成了异氰酸酯封端的聚二甲基硅氧烷（ITPDMS）。然后将ITPDMS用于微级二氧化硅的表面接枝改性。将ITPDMS改性的二氧化硅（P-SiO 2 ）填充到环氧树脂中，以增强二氧化硅与ER基体之间的界面键合。为了进行比较，还研究了用硅烷偶联剂（KH-560）和2，4-甲苯二异氰酸酯等其他化合物对二氧化硅颗粒进行的改性及其颗粒填充环氧树脂的性能。通过FTIR和TG对各种改性和未改性的SiO 2 进行了表征。通过通用测试仪和动态力学分析（DMA）测量填充二氧化硅的ER的机械性能。还通过扫描电子显微镜（SEM）研究断裂表面来评估二氧化硅颗粒填充环氧树脂的形态。结果表明，SiO 2 可以有效地与ITPDMS，TDI和KH-560接枝，并且串联改性的SiO 2 填充的ER系统的拉伸强度和弯曲强度为明显改善。特别是，P-SiO 2 填充的ER系统的拉伸强度和弯曲强度分别比原始SiO 2 填充的ER分别提高了11.68％和11.55％。与原始的SiO 2 填充的ER相比，P-SiO 2 填充的ER系统的玻璃化转变温度也有所提高。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号