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首页> 外文会议>ASME InterPack conference;IPACK2009 >HIGH STRAIN RATE BEHAVIOR OF SN3.8AG0.7CU SOLDER ALLOYS AND ITS INFLUENCE ON THE FRACTURE LOCATION WITHIN SOLDER JOINTS
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HIGH STRAIN RATE BEHAVIOR OF SN3.8AG0.7CU SOLDER ALLOYS AND ITS INFLUENCE ON THE FRACTURE LOCATION WITHIN SOLDER JOINTS

机译：SN3.8AG0.7CU合金的高应变速率行为及其对焊接接头断裂位置的影响。

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摘要

Significant work has been done on the characterization of SnAgCu solder alloys at low strain rates (W~(-6) to 10~(-2)s~(-1)), and as a result, the behavior of solder over these strain rate regimes is well understood. On the other hand, there is a lack of accurate and consistent data for solder at high strain rates. In this paper, we will present data obtained using a servo-hydraulic mechanical tester and split-Hopkinson bar for the Sn3.8wt%Ag0.7wt%Cu solder alloy over strain rates spanning 0.001 to 500s'1. It is shown that the saturation stress correlates well with strain rate over nine decades on a log-log plot. It is also shown that a fit using Anand model based on low strain rate regime (4×10~(-6) to 2×10~(-4)s~(-1)) data captures the high strain rate results to a reasonable accuracy.It is commonly observed that in low strain rate failure, as in thermo-mechanical fatigue, failure tends to occur through the bulk of the solder. However in high strain rate failures, as those seen in drop tests, fractures occur through the intermetallic layer. We present finite element simulations of ball shear and ball pull tests using the above high strain rate data. It is demonstrated how the shift in failure mode from the bulk solder to intermetallic compound may be explained based on the high strain rate behavior of the SnAgCu solder alloy.
机译：在低应变率（W〜（-6）至10〜（-2）s〜（-1））下，SnAgCu焊料合金的表征已进行了大量工作，因此，在这些应变下焊料的行为费率制度已广为人知。另一方面，对于高应变速率的焊料，缺乏准确和一致的数据。在本文中，我们将介绍使用伺服液压机械测试仪和Split-Hopkinson棒获得的Sn3.8wt％Ag0.7wt％Cu焊料合金在0.001至500s'1的应变速率下获得的数据。在对数-对数图上显示，在九个十年中，饱和应力与应变率具有很好的相关性。还表明使用基于低应变率状态（4×10〜（-6）至2×10〜（-4）s〜（-1））数据的Anand模型进行拟合可以将高应变率结果捕获为合理的准确性。 通常观察到，在低应变率失效中，如在热机械疲劳中一样，失效往往通过焊料的大部分发生。但是，在高应变率失效中，如跌落试验中所见，贯穿金属间层会发生断裂。我们使用上述高应变率数据对球剪切和球拉力测试进行了有限元模拟。已经证明了如何基于SnAgCu焊料合金的高应变速率行为来解释失效模式从块状焊料到金属间化合物的转变。

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