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首页> 外文会议>2011 International Conference on Electrical Machines and Systems >Design of high reliability packaging for Fuji High Power Module
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Design of high reliability packaging for Fuji High Power Module

机译：富士大功率模块的高可靠性包装设计

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摘要

Fuji Electric has been involved in efforts to develop innovative power electronics technology, which is crucial for protecting the global environment and the reduction of carbon dioxide emission. 6th Generation IGBT (V-IGBT) has been developed as a key device for innovative power converters. Recently, demand for High Power application increases in such as the wind-power generation and Traction converter. Therefore Fuji Electric concentrates to develop the 6th Generation High Power IGBT Module series. The new Fuji High Power Module had applied the high reliability package technologies such as the terminal bonding with ultrasonic welding and newly solder material between DBC and base plate. The new Fuji High Power Module will contribute to make the large capacity power electronics equipment, especially for applications such as line connection inverter for renewal energy system and large capacity AC drive system highly efficient and long life.
机译：富士电机一直致力于开发创新的电力电子技术，这对于保护全球环境和减少二氧化碳排放至关重要。已开发出第六代IGBT（V-IGBT）作为创新型功率转换器的关键设备。近来，在风力发电和牵引变流器等中对高功率应用的需求增加。因此，富士电机致力于开发第6代大功率IGBT模块系列。新型富士大功率模块采用了高可靠性的封装技术，例如超声波焊接的端子连接以及DBC和基板之间的新焊接材料。新型富士大功率模块将有助于使大功率电力电子设备特别是诸如可再生能源系统的线路连接逆变器和大容量交流驱动系统等应用更高效，长寿命的应用。

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