• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>ASME joint rail conference >CONTACT PATCH COMPARISON BETWEEN A ROLLER RIG AND TANGENT TRACK FOR A SINGLE WHEELSET
【24h】

CONTACT PATCH COMPARISON BETWEEN A ROLLER RIG AND TANGENT TRACK FOR A SINGLE WHEELSET

机译：接触辊钻杆与单个轮子的切线轨道之间的贴片比较

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This study compares contact patch size for a single wheelset when operated on a roller rig with what occurs on a tangent track, using SIMPACK, a multi-body dynamics software. The primary purpose of the study is to determine if one is able to use a roller rig to duplicate and evaluate the contact patch dynamics that occur on a tangent track. The ability to evaluate the contact patch dynamics on a roller rig provides the significant advantage of conducting tests in the controlled environment of laboratory, to more accurately measure the constants that are commonly needed for creepage models, such as Kalker's. The wheelset is modeled as a 6 degrees of freedom (unconstrained) body for the tangent track study. The Wheelset is constrained longitudinally for the roller rig simulations. The wheel-rail interface is modeled using the options available in SIMPACK, which are based on Kalker's empirical creepage model. The simulation data is exported into Matlab for further analysis of the contact patch size. The study suggests that it is possible to use a constant scaling factor for relating the contact patch size on a roller rig with a tangent track, using the constrained contact method. For the elastic contact method the contact patches cannot be related to each other through a constant. In that case, a formula is needed to relate the two contact patches.
机译：本研究比较了单个轮子的接触贴片尺寸，当在滚轮钻机上运行时，在切线轨道上发生的情况，使用Simpack，一种多体动力学软件。该研究的主要目的是确定一种是否能够使用辊子才能副本并评估在切线轨道上发生的接触贴片动态。评估滚轮钻机上的接触贴片动力学的能力提供了在实验室的受控环境中进行测试的显着优势，以更准确地测量爬电器模型（例如Kalker）所需的常数。对于切线研究，轮对作为6度的自由（无约束）体型建模。轮丝被纵向约束，用于滚轮机模拟。轮轨接口使用Simpack中提供的选项进行建模，基于Kalker的经验爬电模型。仿真数据将导出到MATLAB中，以进一步分析接触补丁大小。该研究表明，使用受约束的接触方法，可以使用恒定的缩放因子用切线轨道在滚轮钻机上与切线轨迹相关联。对于弹性接触方法，接触贴片不能通过恒定彼此相关。在这种情况下，需要公式来涉及两个接触贴片。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号