Can we connect trillions of IoT sensors in a sustainable way? A technology/circuit perspective (Invited)

著录项

• 来源
  《IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference》|2015年|1-3|共3页
• 会议地点
• 作者

  Bol David; de Streel Guerric; Flandre Denis;

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• 作者单位

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• 会议组织
• 原文格式 PDF
• 正文语种
• 中图分类
• 关键词

  CMOS integrated circuits; Internet; Internet of Things; digital signal processing chips; electric sensing devices; integrated circuit design; low-power electronics; security of data; CMOS technology scaling; DSP; DSP block; IC design; ICT infrastructure; Internet traffic; Internet-of-Things; IoT nodes; IoT sensors; PM block; RF block; RF spectrum congestion; battery production; battery replacement; carbon footprint; digital signal processing; economical cost; economical level; electrical power consumption; embedded PM; embedded power management; environmental cost; environmental level; low-power wireless RF communication; sensed data privacy; sensed data security; sensor node production; societal level; sustainability issue; ultralow-voltage operation; CMOS integrated circuits; CMOS technology; Digital signal processing; Noise measurement; Radio frequency; Sensors; Wireless communication;

  机译：CMOS集成电路;互联网;物联网;数字信号处理芯片;电传感设备;集成电路设计;低功耗电子设备;数据安全性; CMOS技术扩展; DSP; DSP块; IC设计; ICT基础设施;互联网流量;物联网;物联网节点;物联网传感器; PM块; RF块; RF频谱拥塞;电池生产;电池更换;碳足迹;数字信号处理;经济成本;经济水平;电力消耗;嵌入式PM;嵌入式电源管理;环境成本;环境水平;低功耗无线RF通信;传感数据隐私;传感数据安全性;传感器节点生产;社会水平;可持续性问题;超低压运行; CMOS集成电路; CMOS技术;数字信号处理;噪声测量;射频;传感器;无线通讯;