Low temperature bonding techniques for MEMS devices

机译：MEMS器件的低温粘合技术

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Conventional bonding techniques like fusion, glass frit, soldering, eutectic, and anodic bonding, have been used in packaging for micro-electro-mechanical systems (MEMS). These bonding techniques require high temperature which results in bending/buckling of MEMS devices especially in case of hanging structures. In this work, low temperature and low cost bonding techniques with commercially available epoxy 320 NC and photoresist SU-8 2010 are done. Bonding with commercially available epoxy 320 NC at room temperature leads to spreading of epoxy in device region and affects the device performance. To define bonding ring dimensions, photoresist SU 8 2010 is used as an adhesive. Sharp dimensions of SU 8 2010 bonding ring are achieved using lithography. Top silicon cap is fabricated using TMAH etching. The bonds made with these techniques gave good shear strength, as measured with an indigenous setup.

机译：常规粘合技术类似于熔融，玻璃料，焊接，共晶和阳极粘合，已用于包装用于微机电系统（MEMS）。这些粘合技术需要高温，这导致MEMS器件的弯曲/屈曲，特别是在悬挂结构的情况下。在该工作中，完成了具有市售环氧320nc和光致抗蚀剂SU-8 2010的低温和低成本粘合技术。在室温下与市售的环氧树脂320nc键合导致器件区域中环氧树脂的扩散，并影响器件性能。为了限定粘合环尺寸，光致抗蚀剂SU 8 2010用作粘合剂。使用光刻实现SU 8 2010键合环的尖锐尺寸。使用TMAH蚀刻制造顶部硅盖。用这些技术制备的粘合剂具有良好的剪切强度，用土着设置测量。

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《IEEE Regional Symposium on Micro and Nano Electronics》|2015年|1-4|共4页
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Anuroop; Bansal Deepak; Kumar Prem; Kaur Maninder; Rangra Kamaljit;
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Bonding; Cavity resonators; Micromechanical devices; Packaging; Resists; Silicon; Micro-electro-mechanical system (MEMS); eutectic bonding; localized heating; resistive heating;

机译：粘接;腔谐振器;微机械设备;打包;抵抗;硅;微机电系统（MEMS）;共晶键合;局部加热电阻加热;

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2. Integrating MEMS devices using low-temperature wafer bonding [J] . S. Farrens, P. Lindner, V. Dragoi, Solid state technology . 2006,第2期

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Low temperature bonding techniques for MEMS devices

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