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High Purity Aluminum Coatings Minimize Contamination in Semiconductor fabrication Tools

机译:高纯铝涂层最小化半导体制造工具中的污染

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摘要

1. Purer materials and coatings are needed for next generation semiconductor components 2. Electroplated Al yields better anodize properties than Al 6061 when anodized 3. Improved performance related to 3.1 Higher purity 3.2 Improved structure 4. Results consistent for traditional and advanced anodizations 5. Surface roughness is statiscally significant 6. Crazing and di-electric strength confounded.
机译:1.下一代半导体部件需要熔点材料和涂层2.当阳极氧化3的情况下,电镀A1产生比Al 6061更好的阳极氧化性特性。与3.1更高的纯度3.2改进的结构有关的改进的性能。结果为传统和高级氧化氧化均一致5.表面粗糙度是致命的显着6.裂缝和直视强度混淆。

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