iNEMI released its 2015 Technology Roadmap to members on January 6, 2015 and to the industry for purchase on April 1st. Every two years iNEMI maps future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of several product segments. For the 2017 Roadmap Cycle they are: automotive, consumer/office, medical, portable/wireless, Aerospace/Defense, high-end systems and IoT/Wearables. In addition, it forecasts the technical evolution associated with 21 different areas that support these product area needs. The resulting gaps identified between the product needs and technical capabilities form the basis for iNEMI projects and potential research programs within and outside iNEMI. This paper discusses the upcoming iNEMI 2017 roadmap process and previews expected highlights from 1 product and 2 technology areas from the 2017 iNEMI Roadmap in-process work; the IoT/Wearable PEG and the Board Assembly and Optoelectronic technology TWG chapters. Examples of some timely information on forecast market trends and a section on "situation analysis" and expected challenges facing these technology areas over the ten year horizon of the roadmap will be shared. We will also share results of the ''gap identification'' that came out of the 2015 roadmap. The iNEMI Roadmaps are supported by as many as 15 other organizations (including the SMTA) that provide help from recruiting their members to work on the roadmap, to providing completed chapters. One organization with whom iNEMI has collaborated in the past is the ITRS (International Technology Roadmap For Semiconductors). The ITRS also developed a roadmap every two years and updated their tables every year. Their roadmap covered 15 different areas associated with semiconductor fabrication. The final ITRS2.0 Roadmap is being released June 30 and a new roadmap called the IRDS (International Roadmap For Devices & Systems) is replacing it. The new roadmap is planning to focus much more on "system" drivers. iNEMI collaborated closely with several of the technology groups within the ITRS and ITRS2.0 so the changes to both organizations is impactful. We are now working out the details of our collaborative process going forward. We are also collaborating with the IEEE CPMT Heterogeneous Integration roadmap to the extent that we have joint leadership for it and the iNEMI Packaging & Component Substrates Chapters. IPC, another of our collaborating organizations that has for years provided a chapter on Interconnect PCB (Organic) and continues to do so, has decided not to offer their larger roadmap this year thus concentrating their efforts on the iNEMI Roadmap. The roadmap scene is changing and evolving right along with the electronics industry.
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