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首页> 外文会议>International Conference for High Performance Computing, Networking, Storage and Analysis >Exploring the Potentials of Parallel Garbage Collection in SSDs for Enterprise Storage Systems
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Exploring the Potentials of Parallel Garbage Collection in SSDs for Enterprise Storage Systems

机译：探索用于企业存储系统的SSD中的并行垃圾回收潜力

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In the last decade, NAND flash-based SSDs have been widely adopted for high-end enterprise systems in an attempt to provide a high-performance and reliable storage. However, inferior performance is frequently attained mainly due to the need for Garbage Collection (GC). GC in flash memory is the process of identifying and clearing the blocks of unneeded data to create space for the new data to be allocated. GC is a high-latency operation and once it is scheduled for service to a block of a plane in a flash chip (each flash chip consists of multiple planes), it can increase latency for later arriving I/O requests to the same plane. Apart from that, the consequent high latency also keep other planes of the same chip, that are not involved in this GC, idle for a long time. We show that for the baseline SSD with modern FTL, GC considerably reduces the plane-level parallelism, causing significant performance degradation. There are several circuit-level constraints that make it difficult to allow subsequent I/O operations and/or GCs to be served concurrently from the same chip, but different planes, during the long latency GC. This paper proposes a novel GC strategy, called Parallel GC (PaGC), whose goal is to proactively run GC on the remaining planes of a flash chip whenever any of its planes needs to execute on-demand GC. The resulting PaGC system boosts the response time of I/O requests by up to 45% (32% on average) for different GC settings and across a wide spectrum of enterprise I/O workloads.
机译：在过去的十年中，基于NAND闪存的SSD已广泛用于高端企业系统，以提供高性能和可靠的存储。但是，通常由于需要垃圾回收（GC）经常导致性能下降。闪存中的GC是识别和清除不需要数据块以为要分配的新数据创建空间的过程。 GC是一种高延迟操作，一旦计划将其服务于闪存芯片中的某个平面块（每个闪存芯片由多个平面组成），它就会增加延迟，以便以后到达同一平面的I / O请求。除此之外，随之而来的高等待时间还会使同一芯片中未包含在此GC中的其他平面长时间闲置。我们表明，对于具有现代FTL的基准SSD，GC大大降低了平面级并行度，从而导致性能显着下降。存在多个电路级限制，这使得在长时间延迟的GC中，很难允许随后的I / O操作和/或GC从同一芯片但在不同的平面上同时服务。本文提出了一种新颖的GC策略，称为并行GC（PaGC），其目标是在其任何平面需要执行按需GC时在闪存芯片的其余平面上主动运行GC。对于不同的GC设置以及广泛的企业I / O工作负载，最终的PaGC系统将I / O请求的响应时间提高了多达45％（平均32％）。

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