CarrlCool - the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase

机译：CarrlCool-适用于HPC系统的创新3D插入器平台：分析，仿真，优化，提高可靠性和提高性能的实践

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This paper presents specific solutions dedicated for HPC computer systems to extend critical capabilities of integrated circuits performance by application of the innovative interposer module with special attention paying on signal integrity issues. Research efforts performed by European FP7 project CarrlCool consortium are focused on several fields like Integrated Circuits (IC) cooling efficiency improvement to reach the level of 600W/cm~2 by development of embedded microfluidic structures. Optical communication by dedicated IC interconnects, optimized power delivery by distributed buck converters and electrical communication up to 10GHz assured by optimized 3D interconnecting structures are also in scope of CarrlCool R&D activities.

机译：本文提出了专用于HPC计算机系统的特定解决方案，以通过应用创新的插入器模块来扩展集成电路性能的关键功能，并特别注意信号完整性问题。欧洲FP7项目CarrlCool联盟进行的研究工作集中在多个领域，例如通过开发嵌入式微流体结构来提高集成电路的冷却效率，以达到600W / cm〜2的水平。通过专用IC互连进行的光通信，通过分布式降压转换器优化的功率传输以及通过优化的3D互连结构确保的高达10GHz的电通信也在CarrlCool研发活动的范围之内。

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《Annual TechConnect World Innovation Conference Expo;Annual Nanotech Conference Expo;National SBIR/STTR Conference》|2017年|47-50|共4页
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Grzegorz Janczyk; Tomasz Bieniek; Pawel R. Bajurko;
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3D interposer; 3D integration; TSV; signal integrity; CarrlCool; cooling; modeling; simulation; RF;

机译：3D中介层; 3D整合; TSV;信号完整性; CarrlCool;冷却;造型;模拟;射频;

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2. Development of simulation and optimization platform to analyse maintenance policies performances for manufacturing systems [J] . O. ROUX, M. A. JAMAL, D. AIT KADI, International Journal of Computer Integrated Manufacturing . 2008,第4期

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3. Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis [J] . Che Fa Xing, Zhang Xiaowu, Lin Jong-Kai Microelectronics & Reliability . 2016,第JUNa期

机译：基于硅中介层（TSI）和无硅互连技术（SLIT）的3D IC封装可靠性研究
4. CarrICool - the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase [C] . Grzegorz Janczyk, Tomasz Bieniek, Pawel R. Bajurko Annual TechConnect World Innovation Conference Expo . 2017

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CarrlCool - the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase

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