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首页> 外文会议>IEEE International Workshop on Integrated Power Packaging >Epoxy/h-BN composites based on oriented boron nitride platelets with high thermally conductivity for electronic encapsulation
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Epoxy/h-BN composites based on oriented boron nitride platelets with high thermally conductivity for electronic encapsulation

机译：定向氮化硼片状环氧树脂/ h-BN复合材料，具有高导热性，可用于电子封装

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Owing to the miniaturization of power electronics and the development of portable and flexible devices, demands for highly thermally conductive, mechanically flexible, and electrically insulating composites have substantially increased. The high thermal conductivity of boron nitride (BN) platelets is expected to endow polymer composites with high thermal conductivity. Whilst BN is a typical two dimensional materials, which has anisotropic thermal conductivity. We have reported an remarkably increase in the in-plane thermal conductivity of the BN/epoxy composites through the fabrication of the horizontally aligned and densely packed BN in the epoxy matrix via a vacuum-assisted self-assembly technique. In addition, we compared the influence of the different BN particle sizes on the thermal conductivity of the composites. In this study, the range of BN particles sizes used are 5-8 μm, 15-20 μm and 25-30μm, respectively. The results indicated that the BN with lager size in matrix renders the composites high thermal conductivity at same content. The larger BN platelets can more easily form conductive chains of filler compared to the smaller filler particles. Meanwhile, the smaller filler particle can more easily scatter phonons suppressing heat transfer. It is clear that epoxy with aligned BN platelets has great promising for high thermal conductive insulating materials for the power microelectronics integrated in packaging.
机译：由于电力电子设备的小型化以及便携式和柔性设备的发展，对高导热，机械柔性和电绝缘复合材料的需求已大大增加。氮化硼（BN）薄片的高热导率有望赋予聚合物复合材料以高热导率。 BN是典型的二维材料，具有各向异性的导热性。我们已经报道了通过真空辅助自组装技术在环氧树脂基体中水平排列并密集填充的BN的制造，BN /环氧树脂复合材料的面内导热率显着提高。此外，我们比较了不同BN粒径对复合材料导热系数的影响。在这项研究中，所使用的BN粒径范围分别为5-8μm，15-20μm和25-30μm。结果表明，在相同含量下，基体中具有较大尺寸的BN使复合材料具有较高的热导率。与较小的填料颗粒相比，较大的BN血小板可以更容易地形成填料的导电链。同时，较小的填料颗粒可以更容易地分散声子，从而抑制热传递。显然，具有对齐的BN薄片的环氧树脂对于用于包装中集成的功率微电子的高导热绝缘材料具有巨大的希望。

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