首页> 外文会议>Asia-Pacific Microwave Conference >A 90–140 GHz, High Power Frequency Source Packaged in a Self-Aligned Waveguide Module

【24h】

A 90–140 GHz, High Power Frequency Source Packaged in a Self-Aligned Waveguide Module

机译：装在自对准波导模块中的90–140 GHz高功率频率源

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

This paper presents a solution for packaging monolithic microwave integrated circuit (MMIC) using commercially available liquid crystal polymer (LCP) substrate print circuit board. This package solution comprises of a novel self-aligned microstrip-to-waveguide transition design. For demonstration, an active frequency multiplier-by three MMIC at F-band (90-140 GHz) is packaged into a split-block waveguide module and tested. The circuit is implemented in a 250-nm InP double-heterostructure bipolar transistor technology with ft/fmax 350/650 GHz, respectively. The tripler module has measured output power of 10.6 dBm and a 3-dB output bandwidth of 36.3%, (90-130 GHz). Total power consumption is 156 mW at 2-dBm input power.

机译：本文提出了一种使用市售液晶聚合物（LCP）基板印刷电路板封装单片微波集成电路（MMIC）的解决方案。该封装解决方案包括新颖的自对准微带至波导过渡设计。为了进行演示，将F波段（90-140 GHz）的三倍MMIC的有效倍频封装到一个分体式波导模块中并进行了测试。该电路分别采用ft / fmax 350/650 GHz的250nm InP双异质结构双极晶体管技术实现。三重模块测得的输出功率为10.6 dBm，3 dB输出带宽为36.3％（90-130 GHz）。输入功率为2 dBm时，总功耗为156 mW。

著录项

来源
《Asia-Pacific Microwave Conference》|2018年|261-263|共3页
会议地点
作者
Zhongxia Simon He; Sona Carpenter; Vessen Vassilev; Herbert Zirath;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类
关键词
Probes; Substrates; Bridge circuits; Waveguide transitions; Microstrip; Frequency measurement; Copper;

机译：探头;基板;桥式电路;波导过渡;微带;频率测量;铜;

相似文献

外文文献
中文文献
专利

1. 1.6- and 3.3-W power-amplifier modules at 24 GHz using waveguide-based power-combining structures [J] . Jinho Jeon, Youngwoo Kwon IEEE Transactions on Microwave Theory and Techniques . 2000,第12期

机译：使用基于波导的功率组合结构在24 GHz时提供1.6W和3.3W功率放大器模块
2. Millimeter-Wave Sources at 60 and 140 GHz by Magnetic-Plasmon-Waveguide-Based In-Phase Coupled Oscillator Network in 65-nm CMOS [J] . Yang Shang, Hao Yu, Yuan Liang, IEEE Transactions on Microwave Theory and Techniques . 2016,第5期

机译：65nm CMOS中基于电磁波波导的同相耦合振荡器网络在60和140 GHz处的毫米波源
3. Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules [J] . Zaman A.U., Alexanderson M., Vukusic T., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2014,第1期

机译：间隙波导PMC封装可改善高频微波模块中电路组件的隔离
4. A 90–140 GHz, High Power Frequency Source Packaged in a Self-Aligned Waveguide Module [C] . Zhongxia Simon He, Sona Carpenter, Vessen Vassilev, Asia-Pacific Microwave Conference . 2018

机译：一个90-140 GHz，高功率频率源，包装在自对齐波导模块中
5. I. A 22 GHz VLBI survey of 140 compact extragalactic radio sources. II. VLBA polarization observations of gamma-ray blazars at 15 and 22 GHz. [D] . Moellenbrock, George A., III. 1999

机译：I.对140个紧凑型河外无线电源进行的22 GHz VLBI调查。二。在15 GHz和22 GHz的伽玛射线暴的VLBA极化观测。
6. Impact of High Power Interference Sources in Planning and Deployment of Wireless Sensor Networks and Devices in the 2.4 GHz Frequency Band in Heterogeneous Environments [O] . Peio López Iturri, Juan Antonio Nazábal, Leire Azpilicueta, 2012

机译：大功率干扰源对异构环境中2.4 GHz频段无线传感器网络和设备的规划和部署的影响
7. Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules [O] . Zaman, Ashraf Uz, Alexanderson, M., Vukusic, T., 2014

机译：间隙波导PMC封装可改善高频微波模块中电路组件的隔离
8. Components for Transmission of Very High Power mm Waves (200 kw at 28, 70 and 140 Ghz) in Overmoded Circular Waveguides [R] . Thumm, M., Erckmann, V., Kasparek, W., 1986

机译：在过模圆形波导中传输超高功率毫米波（28k，70和140 Ghz时200 kw）的元件

A 90–140 GHz, High Power Frequency Source Packaged in a Self-Aligned Waveguide Module

摘要

著录项

相似文献

相关主题

期刊订阅