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A Study on Novel Integrated Base Plate (IBP) Package for Power Electronics Module

机译：电力电子模块新型集成基板（IBP）封装的研究

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摘要

DBC substrates and thick copper base plate are commonly used in power module packages. Due to CTE mismatch of various packaging materials, stress and warpage would generate inner module and lead to crack, delamination or fatigue failure. This paper proposes the integrated base plate (IBP) package for power electronics module, and studies its thermal performance and thermal cycling reliability by both experimental and finite element methods. The comparison of temperature distribution between traditional and IBP module during the operation has been presented, and demonstrates the improvement of thermal performance of IBP package. The thermal cycling test results also show that no failure after 500 thermal cycles, which reveal the reliability advantage compared with traditional DBC package.
机译：DBC基板和厚铜基板通常用于功率模块封装中。由于各种包装材料的CTE不匹配，应力和翘曲会产生内部模块并导致破裂，分层或疲劳失效。本文提出了用于电力电子模块的集成基板（IBP）封装，并通过实验和有限元方法研究了其热性能和热循环可靠性。比较了传统和IBP模块在运行过程中的温度分布，并证明了IBP封装的热性能得到了改善。热循环测试结果还表明，经过500次热循环后没有任何故障，与传统的DBC封装相比，它具有可靠性优势。

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