2 integrated circuit, fabricated in a 180 nm process, is designed to operate within the fi'/> A 0.6-mm<sup>2</sup> Powering and Data Telemetry System Compatible with Ultrasound B-Mode Imaging for Freely Moving Biomedical Sensor Systems
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A 0.6-mm2 Powering and Data Telemetry System Compatible with Ultrasound B-Mode Imaging for Freely Moving Biomedical Sensor Systems

机译：兼容B超成像的0.6mm 2 供电和数据遥测系统，可自由移动的生物医学传感器系统

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摘要

A 0.6 mm2 integrated circuit, fabricated in a 180 nm process, is designed to operate within the field of view of an ultrasound B-mode imager, allowing data to be received from ultra-small-form-factor devices that can be localized, powered, and configured as multiple freely moving ingestible or implantable systems. Power is harvested from ultrasound pulses emitted by the imaging transducer array and a bi-directional data link is established that is synchronized to the frame rate of the imager. The chip consumes 57 pW of power and supports data rates of 25 bit/s for uplink and 50 bit/s for downlink for an imager operating at 50 frames per second. Fully packaged within 11 mm3 with a piezoelectric transducer, the chip enables tissue implants as deep as 71 mm. Real-time localizations of devices is possible within the field of view of the imager at 0.8-mm accuracy. An on-chip instruction set allows for software configuration and a smooth transition to a more power-intensive mode of operation using focused ultrasound pulses after localization, with 280 nW power delivery verified using 0.5% duty cycle ultrasound.
机译：0.6毫米 2 以180 nm工艺制造的集成电路，旨在在超声B型成像仪的视场内运行，从而允许从超小型设备接收数据，这些设备可以进行本地化，供电和配置作为多个可自由移动的可摄取或可植入系统。从成像换能器阵列发射的超声脉冲中收集功率，并建立双向数据链路，该链路与成像器的帧速率同步。该芯片功耗为57 pW，并且对于以每秒50帧的速度运行的成像仪，支持25比特/秒的上行链路数据速率和50比特/秒的下行链路数据速率。完全包装在11毫米内 3 借助压电换能器，该芯片可使组织植入物深达71毫米。在成像器的视场内，可以以0.8毫米的精度对设备进行实时定位。片上指令集允许软件配置，并在定位后使用聚焦超声脉冲平稳过渡到功耗更高的操作模式，并使用0.5％占空比超声验证了280 nW的功率输出。

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