A novel structure to realize crack-free plastic package duringreflow soldering process-development of CSS (chip side support) package

机译：一种新型结构，可在生产过程中实现无裂纹的塑料包装回流焊接工艺-CSS（芯片侧支撑）封装的开发

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Reports a novel structure of a plastic package without a die-padwhereby adhesion strength is improved and thermal stress reduced. Thenon-die-pad structure has been realized by the chip side support (CSS)method. Furthermore, this paper describes the derivation of an equationthat can be used as a criterion for judging package cracking ordelamination by comparing the shear strength with the shear stress. Theequation for shear stress can be estimated by the finite element method

机译：报告了不带芯片垫的塑料包装的新颖结构从而提高了粘合强度并降低了热应力。这芯片侧支撑（CSS）实现了非裸片焊盘结构方法。此外，本文描述了方程的推导可以用作判断包装是否开裂的标准或通过将剪切强度与剪切应力进行比较来进行分层。这剪应力方程可通过有限元方法估算

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《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》||p.310-317|共8页
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Nakazawa T.; Unoue Y.; Sawada K.; Sudo T.;
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1. A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package [J] . Nakazawa T., Inoue Y. IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing . 1996,第1期

机译：一种新型结构，可在回流焊接过程中实现无裂纹的塑料封装-芯片侧支撑（CSS）封装的开发
2. Nonhermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5Pb/Sn solder joints of flip-chip bonded multichip module high voltage devices [J] . Ching Ping Wong, Segelken J.M. IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing . 1998,第1期

机译：高压电子开关的非密封塑料封装，采用低应力球状涂层，用于倒装芯片键合多芯片模块高压设备的95 / 5Pb / Sn焊点
3. Laser Ultrasonic Inspection of Solder Bumps in Flip-Chip Packages Using Virtual Chip Package as Reference [J] . Ume C., Gong J., Ahmad R., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第11期

机译：使用虚拟芯片封装作为参考的倒装芯片封装中焊点的激光超声检查
4. A novel structure to realize crack-free plastic package during reflow soldering process-development of CSS (chip side support) package [C] . Nakazawa, T., Unoue, . 2001

机译：一种新型结构，可在回流焊接过程中实现无裂纹的塑料封装-CSS（芯片侧支撑）封装的开发
5. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003

机译：用共晶铅锡和无铅焊料对塑料球栅阵列，芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
6. Structure and properties of Sn-Cu lead-free solders in electronics packaging [O] . Meng Zhao, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子包装中的Sn-Cu无铅焊料的结构和性能
7. Design for Plastic Packages of LSI Chips to Prevent Cracking during Solder Reflow Process. [O] . Toru IKEDA, Yuya UENO, Noriyuki MIYAZAKI, 2001

机译：LSI芯片塑料包装设计，防止焊料回流过程中的开裂。

A novel structure to realize crack-free plastic package duringreflow soldering process-development of CSS (chip side support) package

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