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Via Design in Multi-layer PCB

机译:通过设计在多层PCB中

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摘要

Vias between routing layers induce interconnection discontinuities. Signal reflection on the trace is enhanced because of these discontinuities. Via would be a noise source as the signal frequency increases. The reflection fraction changes with the via geometry properties, especially via height. This paper focuses on the influence of via height on signal reflection. Vias height from 250 μm to 1500μm are studied under high frequency by simulation. The reflection loss caused by via increases with via height nonlinearly. Considering the reflection, an optimization criterion for via design is provided.
机译:路由层之间的孔导致互连不连续性。由于这些不连续性,迹线的信号反射增强。通过信号频率的增加,通孔将是噪声源。反射级别随着通孔几何特性而变化,尤其是通过高度。本文侧重于通孔高度对信号反射的影响。通过模拟在高频下研究250μm至1500μm的通孔高度。通过通孔高度增加的反射损耗是非线性的。考虑到反射,提供了通过设计的优化标准。

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