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Microstructure of Bonding Interface in Explosively Welded Metal/Ceramic Clad

机译:爆破焊接金属/陶瓷包层中粘接界面的微观结构

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Bonding interface in aluminum (Al) and silicon nitride (Si_3N_4) clad fabricated by explosive welding has been investigated by transmission electron microscopy (TEM). The nanocrystalline region was clearly observed at the interface between Al and Si_3N_4. Electron diffraction pattern and energy dispersive X-ray spectroscopy (EDS) measurements across the interface revealed that this nanocrystalline region consist of the only aluminum.
机译:通过透射电子显微镜(TEM)研究了通过爆炸焊接制造的铝(Al)和氮化硅(Si_3N_4)包层中的粘合界面。在Al和Si_3N_4之间的界面处清楚地观察纳米晶区域。界面上的电子衍射图案和能量分散X射线光谱(EDS)测量显示该纳米晶体区域由唯一的铝组成。

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