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REAL-TIME, IN-SITE METROLOGY TO DRIVE REAL-TIME APC

机译：实时，现场现场计量驾驶实时APC

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Real-time, in-situ process sensing already claims wide-spread applications for fault detection as part of advanced process control (APC) in semiconductor manufacturing. However, it is yet to be implemented to drive real-time course correction. Instead, to date, course correction has been mainly focused on run-to-run control based on in-line, ex-situ metrologies. We have developed accurate real-time, in-situ metrologies based on three different sensing techniques (mass spectrometry, acoustic sensing and FTIR) to drive real-time course correction in W CVD processes. Concurrent use of all three sensing techniques for the same batch of deposition processes at 10 Torr has all resulted in film thickness metrologies with accuracies of the order 1% or better (in terms of average uncertainty). In addition, mass spec based metrology was further implemented to drive real-time end point control of film thickness in 0.1 Torr SiH4/WF6 process. The successful demonstrations of accurate sensor-based metrologies and real-time end point control provide for an excellent prognosis in adopting real-time, in-situ sensing technology to support both the fault management as well as course correction aspects of APC in semiconductor manufacturing.
机译：实时，原位流程感测已经要求过度扩展的故障检测应用作为半导体制造中的高级过程控制（APC）的一部分。但是，尚未实施以驱动实时课程校正。相反，迄今为止，课程校正主要集中在基于在线，前原位计量的运行控制。我们基于三种不同的传感技术（质谱，声学感测和FTIR）来开发准确的实时，原位测量，以驱动W CVD工艺中的实时课程校正。同时使用10托的相同沉积过程的所有三种感测技术的使用都导致膜厚度算术，精度为1％或更高（在平均不确定性方面）。此外，进一步实施了基于质量的计量计量，以驱动0.1托SIH4 / WF6过程中的膜厚度的实时终点控制。准确的传感器的韵律和实时终点控制的成功示范提供了采用实时的原位传感技术的优异预后，以支持故障管理以及半导体制造中APC的课程校正方面。

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