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The practice of engineering in the year of the tiger

机译：老虎年度工程的实践

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In this Year of the Tiger the economy is recovering from one of the worst economic crisis of recent years. The global electronics industry has experienced significant consolidations with changes in leadership and new players. The electronics market is brimming with new and exciting electronic products for the ever more connected world. Since the invention of transistor some sixty odd years ago, the progress of electronics has been paced by Moore's Law, and packaging has been an important contributor. With the ascendancy of the consumer market, the function and realm of electronic products have increased many folds, and speed and performance are no longer the sole driver. In this era of More Moore and More than Moore, packaging technology has become the critical enabler for the electronics industry. For the packaging engineering professionals the last decade has been a period of blossoming of many innovations and steady technology advancements. And the pace had not slackened. Cu wirebond is infiltrating the gold wirebond space that has long been occupied since the invention of integrated circuits some sixty years ago. Flip chip CSP and Wafer level CSP are becoming mainstream. And the traditional high lead and eutectic solder materials are being replaced by lead free solder and copper bump. With the advent of deep submicron nodes the study of chip-package interaction is crucial. In the meantime the world of 3D packaging is evolving in measured pace from die stacking, to package on package (POP) and Package in Package (PIP), towards wafer-level fan-out and 2.5 D and 3D IC. Are they real disruptive technologies? And an equally relevant question is Disruptive for Whom? This talk will examine the market landscape and technology trends from the perspective of packaging engineers, and ask ourselves a different and crucial question “how is practice the engineering changing in this Year of the Tiger?”
机译：在今年的老虎中，经济正在从近年来最糟糕的经济危机中恢复。全球电子行业经历了与领导力和新参与者的变化的大大合并。电子产品市场充满了新的和令人兴奋的电子产品，为更多的连接世界。由于晶体管的发明六十多年前，电子产品的进展已经被摩尔定律的定期性，包装是一个重要的贡献者。随着消费市场的升级，电子产品的功能和领域增加了许多折叠，速度和性能不再是唯一的驱动程序。在这个更多的摩尔和摩尔的时代，包装技术已成为电子行业的关键推动因素。对于包装工程专业人员来说，过去十年来一直是许多创新和稳定的技术进步的盛开时期。并且步伐没有闷闷不乐。 Cu Liuebond在大约六十年前渗透到自综合电路的发明以来长期被占用的金线键空间。倒装芯片CSP和晶片级CSP正在成为主流。并且传统的高铅和共晶焊料材料被引导无铅焊料和铜凸块取代。随着深度亚微米节点的出现，芯片包装相互作用的研究至关重要。同时，3D包装世界正在从模具堆叠的测量速度发展，将包装（POP）和包装（PIP）中的包装包装，朝向晶片级扇出和2.5 D和3D IC。他们是真正的破坏性技术吗？一个同样相关的问题是谁的颠覆性？这次谈判将从包装工程师的角度来看市场景观和技术趋势，并询问自己不同和关键的问题“如何在虎队的工程变化的实践如何变化？”

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