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Size Effects on Formability of Copper Foil in Flexible Micro-Bending Process

机译：柔性微弯曲过程中铜箔可成型性的尺寸影响

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The occurrence of size effects in the microforming leads to the uncertainties in process determination and quality control. In this research, a series of experiments were conducted in UTM4104 testing machine to investigate the grain size effect and feature size effect in micro-bending. Different grain size (d), thickness to grain size ratio (N=t/d) and micro-mold feature size (W) were prepared to explore size effects on formability of copper foil. The formability characterized by forming depth, deformation uniformity and surface integrity was discussed. It was found that the normalized forming depth presented a gradually rise and then declined markedly when .V value further decreased to 0.79. The ductile fracture mode was observed for all grain-sized workpiece and the corresponding limit forming depth decreased with increasing grain size. Besides, the thickness thinning distribution and microhardness distribution showed the similar variation tendency like M. Both the standard deviation of thickness reduction and the roughed degree of surface topography indicated the worsening deformation uniformity of the foils with a larger grain size. The inhomogeneous plastic flow of material may be the reason to explain the depression near fracture location which is only observed in coarse-grained workpiece. Overall, it is concluded that the fine-grained copper exhibited better formability as the coarse-grained workpiece experienced severe strain incompatibility.
机译：微造型中的尺寸效应的发生导致过程确定和质量控制的不确定性。在本研究中，在UTM4104测试机中进行了一系列实验，以研究微弯曲的晶粒尺寸效应和特征尺寸效应。制备不同的晶粒尺寸（d），厚度与粒度比（n = t / d）和微模特征尺寸（w）探讨铜箔可塑造性的尺寸。讨论了形成深度，变形均匀性和表面完整性的可形性。发现归一化形成深度呈现逐渐上升，然后在.v值进一步降低至0.79时显着下降。对于所有晶粒尺寸的工件，观察到延性裂缝模式，并且相应的极限形成深度随着晶粒尺寸的增加而降低。此外，厚度细化分布和微硬度分布显示了类似的变化趋势。厚度降低的标准偏差和表面形貌的粗糙度均表示具有较大晶粒尺寸的箔的变形均匀性。不均匀的材料流动可能是解释裂缝位置附近凹陷位置的凹陷的原因，该凹陷位置仅在粗粒粒化工件中观察到。总体而言，得出结论是，细粒铜表现出更好的可成形性，因为粗粒磨削的工件经历了严重应变不相容性。

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