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Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)

机译：光电包装技术开发高密度32通道16 Gbps光学数据链路，用于光电技术联盟（OETC）

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Summary form only given. A parallel, 32 channel, high density (140 /spl mu/m pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed.

机译：摘要表格仅给出。使用现有的GaAs IC，硅光学台阶和多芯片模块技术成功地制造了平行，32通道，高密度（140 / SPL MU / M间距）500Mbps /通道NRZ光学数据链路。将讨论包装设计，实现和链接表征。

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《Lasers and Electro-Optics Society Annual Meeting》|1994年||共1页
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Wong Y.M.; Muehlner D.J.; Institute of Electric and Electronic Engineer;
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中图分类自动化技术、计算机技术;
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专利

1. Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection applications for the optoelectronic technology consortium (OETC) [J] . Yiu-Man Wong, Muehlner D.J. Journal of Lightwave Technology . 1995,第6期

机译：用于光电技术联盟（OETC）的光互连应用的高密度32通道16 Gb / s光学数据链路的技术开发
2. Computer modeling and simulation of the Optoelectronic Technology Consortium (OETC) optical bus [J] . Whitlock B.K., Pepeljugoski P.K. IEEE Journal on Selected Areas in Communications . 1997,第4期

机译：光电技术联盟（OETC）光学总线的计算机建模和仿真
3. Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems [J] . Takahara H. IEEE journal of selected topics in quantum electronics . 2003,第2期

机译：下一代硬件系统的光电多芯片模块封装技术和光输入/输出接口芯片级封装
4. Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC) [C] . Wong, Y.M., Muehlner, . 1994

机译：用于光电技术联盟（OETC）的高密度32通道16 Gbps光学数据链路的光电封装技术开发
5. Platform technologies for hybrid optoelectronic integration and packaging. [D] . Datta, Madhumita. 2002

机译：混合光电集成和封装的平台技术。
6. Health technology assessment (HTA) of optoelectronic biosensors for oncology by analytic hierarchy process (AHP) and Likert scale [O] . Giovanni Improta, Antonietta Perrone, Mario Alessandro Russo, 2019

机译：通过层次分析法（AHP）和李克特量表对肿瘤生物光电生物传感器进行健康技术评估（HTA）
7. Graphical Introduction of Interconnect and Packaging Technologies for Optoelectronic Devices. 3. Optical Modul-Package Technology. [O] . Koji TAKEMURA 1998

机译：光电器件互连和包装技术的图形介绍。 3.光学模型包装技术。
8. Optoelectronic Technology Consortium (OETC) [R] . 1996

机译：光电技术联盟（OETC）

Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)

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