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A novel architecture to facilitate disassembly and reuse of electronic components and sub-assemblies

机译：一种便于拆卸和重用电子元件和子组件的新架构

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摘要

This paper has advanced the proposition that in many electronic products, the partitioning scheme adopted and the interconnection system used to interconnect the sub-assemblies or components are intimately related to the economic benefits, and hence the attractiveness, of reuse of these items. An architecture has been developed in which the residual values of the connectors, components and sub-assemblies are maximised, and opportunities for take-back and reuse of redundant items are greatly enhanced. The system described also offers significant manufacturing cost benefits in terms of ease of assembly, compactness and robustness.
机译：本文提出了在许多电子产品中，采用的分区方案和用于互连子组件或组件的互连系统与经济效益密切相关，并因此对这些物品的吸引力密切相关。已经开发了一种架构，其中连接器，组件和子组件的剩余值最大化，并且大大提高了回收和重用冗余物品的机会。在装配，紧凑性和鲁棒性方便的方面，所述系统还提供了显着的制造成本优势。

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