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Combined 3D-Shape and Deformation Analysis of small Objects using Coherent Optical Techniques on the basis of Digital Holography

机译:基于数字全息术基于数字全息技术的相干光学技术组合3D形和变形分析

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摘要

Progresses in microsystem technology promise a lot of new applications in industry and research. However, the increased complexity of the microsystems demand sensitive and robust measurement techniques. Fullfield and non invasive methods are desirable to get access to spatially resolved material proeprties and parameters.
机译:微系统技术的进展承诺工业和研究中的许多新应用。然而,微系统的复杂性提高了敏感和鲁棒的测量技术。 Fullfield和非侵入性方法是理想的,可以访问空间分辨的材料ProEpries和参数。

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