首页> 外文会议>International Conference on High Performance Structures and Materials >Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region
【24h】

Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region

机译:利用晶界区空置扩散性增强的模型分析亚微米Cu互连结构的扩散应力松弛

获取原文

摘要

We propose the finite element simulation technique to model the process of diffusional creep and stress relaxation that occurs in Cu-damascene interconnects of integrated circuit devices in the processing stage. On the length scale of the interconnect lines (microns), the stress-induced mass flow constitutes the major mechanism of inelastic deformation. The mass flow problem is coupled to the stress analysis through vacancy flux and equilibrium vacancy concentration, allowing independently for the concentration profile and evolution of the stresses and strains in an iterative process to be solved. We decompose the total displacement field into the elastic part and the inelastic mass flow contribution. Performing the stress analysis in the configuration with accumulated inelastic displacements, we ensure that the shape of the interconnect line is compatible with external geometrical constraints throughout the simulation. This approach has been implemented in the software package that seamlessly integrates the problem-oriented code with the commercially available finite element program MSC.Marc. We apply the technique to model the Coble creep phenomenon by introducing the nanoscale grain boundary region having the thickness of the order of several layers of atoms. As an illustration, the problem of stress relaxation in a single grain subjected to prescribed displacements and tractions is examined.
机译:我们提出了用于模拟在加工阶段中的集成电路器件的Cu - 镶嵌互连中发生的扩散蠕变和应力松弛过程的有限元模拟技术。在互连线(微米)的长度尺度上,应力诱导的质量流量构成无弹性变形的主要机理。通过空位助焊剂和平衡空位浓度耦合质量流量问题与应力分析,允许独立于浓度曲线和应力和菌株在待解决的迭代过程中的浓度分析。我们将总位移场分解为弹性部件和非弹性质量流量贡献。在具有累积的非弹性位移的配置中执行应力分析,我们确保互连线的形状与整个模拟中的外部几何约束兼容。这种方法已经在软件包中实现,该软件包与商业上可用的有限元程序MSC.MARC无缝地集成了面向问题的代码。我们通过引入具有若干层厚度的厚度的纳米级晶界区域来应用该技术来模拟甲状腺蠕变现象。作为说明,检查了对规定位移和牵引力进行的单个谷物中的应力松弛问题。

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号