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首页> 外文会议>International Conference on Electronic Packaging Technology High Density Packaging >Investigation on fabricating high SiC volume fraction of electronic package shell by means of semi-solid forming
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Investigation on fabricating high SiC volume fraction of electronic package shell by means of semi-solid forming

机译：通过半固体成型制造电子包装壳体高级壳体壳体的研究

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Based on the research of modern electronic packaging materials, Semi-solid forming technology was used to fabricate electronic packaging shell in this study. Packaging material of SiC reinforced A356 aluminum alloy was prepared by mechanical mixing method and the SiCp/Al composite billet was formed by means of thixo-forging to manufacture the electronic packaging shell. The numerical simulation was conducted for investigating the process of thixo-extrusion with SiCp/A356 composites. Then microstructure of the produced parts and simulation results were investigated. The results showed that after being heated to 600°C and held for 3 hours, SiCp had good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet could meet the requirements of thixo-forging. The investigation showed that thixoforming technology could be used in producing electronic package shell with high SiC volume fraction from SiCp/A356 composites.
机译：基于现代电子包装材料的研究，半固体成型技术用于制造本研究中的电子包装壳。通过机械混合方法制备SiC增强A356铝合金的包装材料，通过仿真制造SICP / Al复合坯料来制造电子包装壳。进行了数值模拟，用于研究与SICP / A356复合材料的硫缀挤出方法。然后研究了所产生的零件和仿真结果的微观结构。结果表明，在加热至600℃并保持3小时后，SICP与A356铝合金良好，SICP / A356复合坯料可以满足Thixo锻造的要求。该研究表明，触变性技术可用于生产具有来自SICP / A356复合材料的高SiC体积分数的电子包装壳。

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