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首页> 外文会议>International Conference on Flexible and Printed Electronics >Investigation on electrical stress over metal-insulator-metal (MIM) structures based on compound dielectrics for the inkjet-printed OTFT stability
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Investigation on electrical stress over metal-insulator-metal (MIM) structures based on compound dielectrics for the inkjet-printed OTFT stability

机译：基于复合电介质的金属绝缘体 - 金属（MIM）结构对喷墨印刷的OTFT稳定性的电力 - 金属 - 金属（MIM）结构的研究

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One of the greatest challenges in the field of printed electronics is the performance stability of the devices fabricated by the different printing technologies e.g. inkjet or gravure printing technology. The performance instability can be defined in terms of the device breakdown or by other effects like the emergence of leakage current under the constant high voltage inputs (especially the dielectric within the transistor architecture). The reasons behind this phenomenon can be various, but the most prominent indication can be detected from the materials used and the deposition methodology. For this purpose the herein work is presented, targeting on the all inkjet-printed organic thin film transistor (OTFT), but keeping the focus on the basic building block for fabricating inkjet-printed OTFTs. In this case it is the metal-insulator-metal (MIM) layer structure. Herein, the MIM structures are inkjet-printed, and then characterized optically and electrically. The dielectric layers for the MIM structures are printed using three different dielectric ink materials either individually 1) Single component system; or in combination with each other as in form of bi-layer stack 2) Multiple component system. The thickness of the printed dielectric layers is varied for these MIM structures. The electrical characterization is performed with respect to current vs. applied voltage and is done for a large number of iterations. The leakage current is of interest and shows a negative and positive trend towards the single component system and multiple component system for the dielectric layers in the MIM characterization structures respectively.
机译：印刷电子产品领域的最大挑战之一是由不同印刷技术制造的设备的性能稳定性。喷墨或凹版印刷技术。性能不稳定性可以根据器件故障或其他效果来定义，如恒定的高压输入下的漏电流的出现（尤其是晶体管架构内的电介质）的出现。这种现象背后的原因可以是各种各样的，但可以从所用材料和沉积方法中检测到最突出的指示。为此目的，本文的作品是牵引的，靶向所有喷墨印刷的有机薄膜晶体管（OTFT），而是将聚焦保持在用于制造喷墨印刷的OTFT的基本构件块上。在这种情况下，它是金属绝缘体 - 金属（MIM）层结构。这里，MIM结构是印刷的喷墨，然后光学和电动表征。用于MIM结构的介电层使用单独的1）单组分系统使用三种不同的介电油墨材料印刷;或者与双层堆叠2的形式相互组合，多个组件系统。对于这些MIM结构，印刷介电层的厚度变化。相对于电流与施加电压执行电学表征，并且用于大量迭代进行。泄漏电流是感兴趣的，并且分别示出了对单一组件系统和用于MIM表征结构中的电介质层的多个组件系统的负且正趋势。

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