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A Broadband Microstrip-to-Folded Substrate Integrated Waveguide Transition and In-phase Power Divider

机译:宽带微带上折叠基板集成波导转换和相位功率分压器

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In this paper, a novel microstrip-to-FSIW (folded substrate integrated waveguide) is proposed, which has a lot of good performances such as low return loss and insertion loss from 6GHz to 13.8GHz. The field in FSIW has been studied before and is folded in H plane for TE10 mode. The field in the underneath substrate is similar to microstrip and the whole field in FSIW is similar to stripline so that the proposed transition can be realized by using stripline. In order to reduce the radiation loss, the stripline is shielded by two rows of conduct holes to constrain the field. What is more, an inductive metal via hole is positioned on the interface of stripline and FSIW to obtain better impedance matching in a broader bandwidth. There are some other types of transitions shown in this paper for comparison and an in-phase power divider is shown. The measured results are in good agreement with the simulated results.
机译:在本文中,提出了一种新型微带至FSIW(折叠的基板集成波导),其具有许多良好的性能,例如低回波损耗和从6GHz到13.8GHz的插入损耗。 FSIW中的字段已经研究过,并在H平面中折叠以进行TE10模式。下面的底物中的磁场类似于微带,并且FSIW中的整个场类似于带状线,使得可以通过使用带状线来实现所提出的转变。为了减少辐射损失,带状线被两排电导孔屏蔽以限制该领域。更重要的是,电感金属通孔位于带状线和FSIW的界面上,以获得更好的阻抗匹配在更宽的带宽中。本文中显示了一些其他类型的转换,以进行比较,并示出了同相功率分频器。测量结果与模拟结果吻合良好。

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