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Experimental Study on the Surface Cutting Mechanical Properties of Single Crystal Silicon in Micro-nano Scale

机译:单晶硅在微纳米尺度中切割力学性能的实验研究

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The experiment of cutting mechanical properties of single crystal silicon surface in the micro-nano scale is researched using nano-indenter and atomic force microscopy. The result of the experiment shows that: in the constant load, the impact of different scratching velocity for single crystal silicon surface scratch groove width and chip accumulation volume are not big;;but the cutting force and friction coefficient are not increases with the scratching velocity increases;;when the scratching speed is certain, the size of load has a greater impact on the cutting mechanical properties of single crystal silicon surface, with the increase of the load, the cutting force increases, but the cutting force is not linearly growth.
机译:利用纳米压模和原子力显微镜研究了微纳米尺度中单晶硅表面的切割力学性能的实验。 实验结果表明:在恒定负荷下,单晶硅表面划痕槽宽度和芯片堆积量不同的划痕速度的影响不是大的;但是切割力和摩擦系数不会随着刮擦速度而增加 增加;;当刮擦速度确定时,负载尺寸对单晶硅表面的切割力学性能具有更大的影响,随着负载的增加,切割力增加,但切割力不具有线性生长。

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