3D FEM SIMULATION OF FEED-BLOCK PROFILING FOR FLAT DIE COEXTRUSION

机译：用于平模共挤出的馈电分析的3D FEM模拟

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This paper presents the results of a 3D FEM analysis of some layer spreading experiments performed on flat die with a coextrusion feed-block. The complete feed-block and die assembly was simulated using a commercially available 3D FEM software package and a path-line analysis was used to determine the interface position and the degree the of layer spreading. The results obtained were in good agreement with the experimental data. The simulation also provided a better insight into the flow development within these types of systems.

机译：本文介绍了用共挤出馈电块在平模上进行的一些层扩展实验的3D对分析的结果。使用市售的3D FEM软件包模拟完整的馈电块和模具组件，并且使用路径分析来确定接口位置和层扩散的程度。获得的结果与实验数据吻合良好。仿真还提供了更好地深入了解这些类型系统内的流动开发。

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《Polymers, laminations coatings conference》|2001年||共8页
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3D FEM SIMULATION OF FEED-BLOCK PROFILING FOR FLAT DIE COEXTRUSION

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