Cluster tools are prevalent in wafer fabs. The main reason for this prevalence is that the integration of simple sequential steps together with wafer handling equipment reduces the cost significantly with shared facitilies and smaller foot-prints. This paper analyzes the performance of a wet bench tool in a wet cleaning process by means of a detailed simulation model under different operating factors. The results of the simulation experiments show that through reconfiguration of the recipe sequence types that a 18% improvement in average hourly throughput can be realised under the same average cycle time.
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